VIA Technologies has announced its first mobile chipset to integrate 2D and 3D graphics capabilities. The chipset, called Twister, is the result of the company's joint merger with S3 Graphics, and it combines the Apollo Pro133A chipset with S3's Savage 4 graphics architecture. Twister is designed to save space and power in notebook systems and will work with Intel's Celeron and Pentium III processors as well as VIA's upcoming Cyrix III CPU. VIA expects the chipset to ship in quantity to manufacturers this winter.
zpostcode 
Recruit 
weather 
mreligion 
Yellowpages 
sport 
constellation 
shopping 
name 
game 
directory 
literature 
Word 
tour 
furnish 
Lottery 
tftnews 
lyrics 
News 
digital 
car 
dir 
Edu 
Finance 
